Abstract: The localization system has been extensively studied because of its diverse applicability, for example, in the Internet of Things, automatic management, and unmanned aerial vehicle services.

O3DE (Open 3D Engine) is an open-source, real-time, multi-platform 3D engine that enables developers and content creators to build AAA games, cinema-quality 3D worlds, and high-fidelity simulations ...

Abstract: The crossbar structure of the nonvolatile memory enables highly parallel and energy-efficient analog matrix-vector-multiply (MVM) operations. To exploit its efficiency, existing works design ...

MRTK3 is the third generation of the Mixed Reality Toolkit for Unity. It's an open source project designed to accelerate cross-platform mixed reality development in Unity. MRTK3 is built on top of ...

Git isn't hard to learn, and when you combine Git and GitHub, you've just made the learning process significantly easier. This two-hour Git and GitHub video tutorial shows you how to get started with ...

Unity Software (U) appears poised to continue making gains with Vector, its AI-powered ad platform launched last year, as the company prepares to sunset its ironSource advertising network, according ...

India advanced its semiconductor push as Ashwini Vaishnaw and Mohan Charan Majhi laid the foundation stone for the country’s first 3D glass semiconductor packaging unit at Info Valley, Bhubaneswar, ...

Odisha is emerging as a significant player in advanced sectors like electronics and semiconductors with the inauguration of India's first 3D glass substrate packaging facility. This Rs 1,943 crore ...

In a significant step towards building a domestic semiconductor ecosystem, the Ministry of Electronics and IT on Saturday oversaw the groundbreaking of India’s first advanced 3D semiconductor ...

Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous integration ...

The foundation stone for India’s first advanced 3D chip packaging unit was laid in Bhubaneswar, a project which IT Secretary S Krishnan said can put the country “on the map” in terms of advanced chip ...

India’s push to build a complete semiconductor ecosystem has taken a decisive turn. On 19 April 2026, the country marked a significant milestone with the groundbreaking of its first advanced ...