Lam Research powers AI chipmaking with leading etch/deposition tools and recurring service revenue. Click here to find out ...

SEM (scanning electron microscope) images of test chip designed by Deca. Upper left show a molded multi-chip fan-out package with close-ups of the embedded die right and below The last time I wrote ...

Global semiconductor equipment suppliers are accelerating their push into advanced packaging. They are positioning back-end ...

In southern Taiwan, suppliers once tied to steel, plastics, and display panels are pivoting toward chipmaking as booming AI demand and geopolitical risks push chipmakers to localize sourcing.

Apple Inc. today announced that it will become the first and largest customer of a $2 billion chip packaging facility Amkor Technology Inc. is building in Arizona. The facility will process chips that ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

The news is coming from TheElec, with their sources saying Samsung's Advanced Package (AVP) team will be providing an interposer and I-Cube -- its 2.5D package -- to NVIDIA. Other companies will ...