Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

Dynamic optimisation and model predictive control (MPC) are at the forefront of modern process systems engineering, offering robust methodologies to address the challenges posed by time-varying ...

While dynamic modeling is arguably one of the most important technological developments for engineers in the last 50 years, many process control engineers are unable to use it. It requires proper time ...

My last two columns dealt with point selection and sequence writing. These determine the majority of a BAS project’s scope of work; however, there is one other issue necessary to the core of the ...